With the bar via configuration, solid vias connect the thick metal conductors as illustrated below. Because the vias are solid, these vias carry horizontal sidewall currents in parallel to the currents carried by the thick metal conductors. These sidewall currents have the effect of decreasing the loss of the overall metal stackup, and are accurately accounted for by the Sonnet analysis engine, em.
For more information on how bar vias are modeled in Sonnet, please see Simplifying Bar Vias in the Analysis Engine.