It is possible to link the physical characteristics of another project including its Technology Layers, dielectric stackup information, metal types, dielectric brick materials and top and bottom cover metal. When you select Circuit - Technology File - Link from the project editor menu, a Browse window appears which allows you to select a Sonnet Technology File (.stf), Sonnet project, or substrate file (.matl).
When you link a technology, the following occurs:
- Your project's dielectric layer stackup is completely replaced with the new dielectric layer stackup. Be careful if the number of dielectrics in your project does not match the number of dielectrics in the loaded technology file because unexpected results may occur.
- Your project's top and bottom box cover properties are replaced.
- All metal and brick types in your original project will be removed and replaced with all the ones from the technology file.
- All Technology Layers in your original project will be removed and replaced with all the ones from the technology file.