Via Array Configuration

In the case of the via array configuration, there is physical separation between each of the individual vias making up the array. Thus, there is no horizontal sidewall current on these vias. Only the thick metal conductors carry horizontal current. This condition is accurately accounted for by the Sonnet analysis engine, em, as is computes the loss of stackups with this type of cross-section.

For more information on how via arrays are modeled in Sonnet, please see Via Array Simplification.